About Atum Works

We're a well-funded startup on a mission to extend humanity's ability to structure matter at the smallest scales in three dimensions. Atum Works is building the world's first scalable 3D lithography foundry, unlocking nanoscale manufacturing and forging the next generation of microelectronics: smaller, denser, and infinitely customizable. By crossing the cost and speed thresholds that make 3D microfabrication commercially viable, we're enabling technology to finally catch up with nature's three-dimensional complexity and opening the door to a future of full-dimensional manufacturing.

Position Summary

We are looking for a highly motivated and detail-oriented R&D Process Engineer to invent, characterize, and scale-up novel electrochemical and materials deposition processes. The successful candidate will possess a strong theoretical background in electrochemistry and an integrated understanding of polymer and materials chemistry. This expertise is crucial for addressing complex challenges at the interface of plating and patterning. A primary focus of this role will be developing high-precision plating solutions, enabled by cutting-edge resist technology, for advanced device architectures.

Key Responsibilities

• Novel Plating Process Invention: Design and execute R&D experiments to develop new plating and wet-chemical deposition processes (Electroplating/ECD) for unique materials and structures.
• Fundamental Characterization: Deeply characterize new processes using electrochemical methods, analytical chemistry, and advanced metrology to understand mechanism, kinetics, and material properties.
• Surface Science Expertise: Develop and apply surface modification techniques and pre-treatment processes to optimize plating.
• Chemistry & Tooling Optimization: Work closely with chemical suppliers and internal teams to iterate on plating bath chemistry, additive performance, and small-scale tooling design to improve process control and quality.
• IP Generation: Drive the creation of new Intellectual Property (Patents) related to novel plating chemistries, process methods, and patterning materials.
• Process Documentation & HVM Hand-off: Rigorously document all experimental findings, establish Design of Experiments (DOE), and ensure scalability and manufacturability for eventual transfer to high-volume manufacturing (HVM).
  
  

Required Qualifications

• Education: M.S. or Ph.D. in Chemical Engineering, Materials Science, Analytical Chemistry, Polymer Chemistry, Electrochemistry or equivalent.
• Experience: 3+ years of hands-on R&D experience in developing Electroplating (ECD) processes, preferably in the semiconductor, microfabrication or equivalent sectors (e.g. batteries).
• Technical Expertise (Electrochemistry): Strong theoretical and practical knowledge of electrochemical principles, bath stability, and process control in wet-chemical deposition.
• Integrated Materials Knowledge: Proven ability to manage and optimize chemical interactions between plating baths, substrates, and masking materials.
  
  

Additional Preferred Skills

• Experience with process development for semiconductor packaging or back end of line (BEOL).
• Familiarity with industrial plating tools (e.g., rack plating, fountain plating, PCB plating, or other wafer level platers.)
• Experience with statistical process control (SPC) and data analysis tools.
  
  

Compensation And Benefits

• $160-180k (depending on level of experience) + equity
• Medical, Dental, Vision and 401k matching.
• Free daily lunches